Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques This is scarry technology, but we're already seeing a lot more lately. Already, memory chips can get up around 300 layers but, of course, it gets expensive, and memory is usually cheap to buy. The difference here, is they're producing high speed Dram, and not flash memory, and the chips they're making could also be combined with processors, which require even higher speed transistors. I would estimate a single 120 layer chip, would have several trillion transistors, half of which can be used for memory, and you can processing faster on the gallium side, and memory on the silicon side of each layer, making the damn thing at least ten times faster, and million times more efficient, than a server today. All within an ordinary looking chip that is maybe two centimeters tall.
Instead of "several trillion transistors", how about several million trans-sisters? Imagine what they could do!